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  FSB-B75G
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Full-Size SBC with Intel® 3rd Generation Core™ i7/i5/i3 Processor

Main Features

  • Intel® 3rd Generation Core™ i7/i5/i3 LGA 1155 Processor
  • Intel® B75 Chipset
  • Dual-Channel DDR3 Memory DIMM Socket x 2, Up to 16GB
  • Intel® B75 Integrated Intel® HD Graphics
  • Gigabit Ethernet x 2
  • SATA 6.0Gb/s x 1, SATA 3.0Gb/s x 2, CFast™ x 1
  • COM x 2, USB3.0 x 4, USB 2.0 x 6
  • PICMG 1.0
  • ATX 2.1 Power Requirement
Specifications Ordering Information

The FSB-B75G is powered by Intel® 3rd Generation Core™ i7/i5/i3 LGA1155 socket PICMG 1.0 with onboard Intel® B75 chipset. Utilizing PICMG 1.0, ensures compatibility with legacy ISA and PCI interfaces, while the Intel® B75 Chipset and 3rd Generation Core™ processor utilize less power and enhanced graphics performance over previous generations. A major benefit of the FSB-B75G’s design is that it offers a high level of system failure resistance and is ideally suited for the increasingly complex demands of industrial automation applications, banking and more. As a single plug-in card for modular systems, maintenance and component replacements are made easy with the added benefit of reduced down time.

Combined with multiple USB and SATA storage connectors and supporting up to 16GB of DDR3 1333/1600 of system memory and an onboard CFast™ slot, the FSB-B75G offers a powerful solution for System Integrators. This PICMG 1.0 full-size SBC provides superb features in a form factor that allows for easy system configuration and expansion. This makes the FSB-B75G an excellent choice for applications requiring embedded systems with optimal performance and high tolerance. Operating temperature for the FSB-B75G is 0°C to 60°C.

Applications

  • Network Security
  • Factory Automation
  • Machine Automation
  • DVR/Surveillance
  • Telecom
  • Transportation/ITS
  • Application Server
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